Stress Changes of Nanocrystalline CoNi Films Electrodeposited from Chloride Bath

소개글

전해 도금 시 Chloride의 첨가에 따른 변화에 대한 실험 자료입니다.

목차

1. Electroplating / Electrodeposition
2. Application of electrode and electroless deposition
3. Advantages and Disadvantages
4. Compositions and operating conditions of Chloride baths
5. Composition and Stress of Chloride baths
6. The surface morphology of CoNi thin films
7. XRD analysis
8. Microstructure and Grain sizes
9. Conclusion

본문내용

Recent Applications
ULSI Application
Copper Metallization : IBM 1997
Replace aluminum Interconnects with copper

MEMS Application
LIGA (or LIGA- like process): 1990
Fabrication Microstructure by Electroforming
RF MEMS, Bio MEMS Fabrication

Packaging Application
UBM (Under Bump Metallurgy): 1997
Fabrication of Ni/Au by Electroless Plating

Advantages and Disadvantages

Advantages
•Low production cost
• Suitable to large scale plating
• rapid deposition rate
• various deposition parameters
• easy scale up and maintenance

Disadvantages
• Contamination or impurities in film
• Reproducibility
• Toxic waste generation

참고 자료

Stress Changes of Nanocrystalline CoNi Films Electrodeposited from Chloride Bath