[레포트] 반도체 공정 및 응용 HW#1
- 최초 등록일
- 2019.09.28
- 최종 저작일
- 2019.09
- 5페이지/ 한컴오피스
- 가격 1,000원
* 본 문서(hwp)가 작성된 한글 프로그램 버전보다 낮은 한글 프로그램에서 열람할 경우 문서가 올바르게 표시되지 않을 수 있습니다.
이 경우에는 최신패치가 되어 있는 2010 이상 버전이나 한글뷰어에서 확인해 주시기 바랍니다.
목차
1. Comparison of conventional MOSFET and Fin FET (Including feature, structure, working principle, fabrication sequence, etc.)
2. Comparison of SOI and Bulk FinFET (Including features, structure, Pros &Cons, etc.)
3. Reference Site
본문내용
Most commonly used Si-based MOSFETs have the above structure. At the top, at the bottom, you can electrically separate the gate from the Semiconductor channel. There is an oxide layer.In other words, the voltage at the gate is separated from the semiconductor part below by a subconductor called Oxide. Ideally, only an electric field is created between the gate and the channel, but there is no current. (However, there may actually be some leak current.) Oxide materials are mostly dielectric.
If the (+) voltage is applied to the gate terminal with the source terminal grounded, an electric field is formed in the lower direction and a (-) area is formed below the oxide membrane.
참고 자료
https://www.techdesignforums.com
http://cfile4.uf.tistory.com
https://cdn.sparkfun.com
https://pdfs.semanticscholar.org/2855/840c4fe4a953eaddf0086d4c33ba17a20944.pdf
https://semiwiki.com/x-subscriber/stmicroelectronics/2891-the-alternative-to-finfet-fd-soi/